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Showing: Home / Featured / Multi-Terabit Switch Chips & Software

Multi-Terabit Switch Chips & Software

October 2018

Cloud-based services and the data centers required to deliver those services are driving strong demand for high-performance switch chips that can handle up to 12.8 Tbit/s in a single device. Following significant investment over the past five years, there are now more companies than ever before with competitive Ethernet switch chips. The market is rapidly moving to 100 Gbit/s connections within large data centers, but there is still a strong market for Ethernet switch chips with large numbers of 10 Gbit/s and 25 Gbit/s ports. The industry is now preparing for the move to 200 Gbit/s and 400 Gbit/s with the first switch devices in production and the first systems introduced.

This report details and analyzes more than 40 high-performance Ethernet switch devices, embedded SDN, operating system software and IP solutions, identifying the key requirements and highlighting the advantages they hold for equipment manufacturers and service providers. It also reviews vendor strategies and surveys component features, performance and flexibility in this important market. Further, this report profiles 15 vendors in the market.

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Simon Stanley

Simon is the Founder and Principal Consultant at Earlswood Marketing and has over 25 years experience, holding marketing and technical positions at various companies including National Semiconductor and Fujitsu covering Europe, North America and Japan. Simon has wide experience of networking technologies and semiconductor solutions including 100G/ 400G, NFV/SDN, LTE, ATCA, G.Fast/DSL, multicore processors, FPGAs and switch fabrics for both consumer and business applications.

Total Access – Components Reports

Access all Heavy Reading Components Reports providing in-depth research and competitive analyses for critical components and subsystems markets, including 100/400G optical, LTE, SDN, switch products, multicore processors, and white box/COTS components.

Events

ECOC Exhibition and Conference 2019

TUESDAY 24RD AND WEDNESDAY 25TH SEPTEMBER 2019

Dublin, Ireland Simon Stanley will be at ECOC 2019 on the Tuesday afternoon and Wednesday. ECOC is the largest conference and … read more

Webinar Signup

FTTx Mantra – Building Next-Generation Scalable Access Networks

Thursday, October 31, 2019, 10:00 a.m New York / 2:00 p.m LondonSponsors: STL Register to listen

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