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Showing: Home / Webinars / Archived Webinars / Electronic and photonic building blocks for high-speed wireline transceivers

Electronic and photonic building blocks for high-speed wireline transceivers

Thursday, March 31, 2022, 11:00 a.m. New York / 4:00 p.m. London Sponsors: IMEC

Especially inside the large data centers that underpin today’s cloud and internet infrastructure, traffic keeps growing exponentially. As a result, the industry is now looking at 800G- and even 1.6T-capable optical (pluggable) transceivers, and co-packaged optics with even higher capacities. Maintaining transceiver footprints requires significant advances in terms of energy efficiency, integration density and bandwidth of both the electronic and photonic components of next-gen wireline transceivers.

Topics that will be addressed during this webinar include:

  • The use of SiGe BiCMOS to achieve beyond 100Gbaud operation as a more accessible alternative to compound semiconductors in analog electronic integrated circuits such as drivers and receivers.
  • The move towards 5- and even 3nm CMOS for next-generation ADCs and DACs.
  • Novel approaches for dense integration of electronic and photonic components with unprecedented integration density and manufacturing scalability.
  • Moving functionality from the electronic to the optical domain using new schemes such as optical domain equalizers.

Simon Stanley

Simon is the Founder and Principal Consultant at Earlswood Marketing and has over 25 years experience, holding marketing and technical positions at various companies including National Semiconductor and Fujitsu covering Europe, North America and Japan. Simon has wide experience of networking technologies and semiconductor solutions including 100G/ 400G, NFV/SDN, LTE, ATCA, G.Fast/DSL, multicore processors, FPGAs and switch fabrics for both consumer and business applications.

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