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Showing: Home / Webinars / Archived Webinars / Electronic and photonic building blocks for high-speed wireline transceivers

Electronic and photonic building blocks for high-speed wireline transceivers

Thursday, March 31, 2022, 11:00 a.m. New York / 4:00 p.m. London Sponsors: IMEC

Especially inside the large data centers that underpin today’s cloud and internet infrastructure, traffic keeps growing exponentially. As a result, the industry is now looking at 800G- and even 1.6T-capable optical (pluggable) transceivers, and co-packaged optics with even higher capacities. Maintaining transceiver footprints requires significant advances in terms of energy efficiency, integration density and bandwidth of both the electronic and photonic components of next-gen wireline transceivers.

Topics that will be addressed during this webinar include:

  • The use of SiGe BiCMOS to achieve beyond 100Gbaud operation as a more accessible alternative to compound semiconductors in analog electronic integrated circuits such as drivers and receivers.
  • The move towards 5- and even 3nm CMOS for next-generation ADCs and DACs.
  • Novel approaches for dense integration of electronic and photonic components with unprecedented integration density and manufacturing scalability.
  • Moving functionality from the electronic to the optical domain using new schemes such as optical domain equalizers.

Listen to archive

Simon Stanley

Simon is the Founder and Principal Consultant at Earlswood Marketing and has over 25 years experience, holding marketing and technical positions at various companies including National Semiconductor and Fujitsu covering Europe, North America and Japan. Simon has wide experience of networking technologies and semiconductor solutions including 100G/ 400G, NFV/SDN, LTE, ATCA, G.Fast/DSL, multicore processors, FPGAs and switch fabrics for both consumer and business applications.

Total Access – Components Reports

Access all Heavy Reading Components Reports providing in-depth research and competitive analyses for critical components and subsystems markets, including 100/400G optical, LTE, SDN, switch products, multicore processors, and white box/COTS components.

Events

ECOC Exhibition and Conference 2023

TUESDAY 3rd AND WEDNESDAY 4th October 2023

Glasgow, Scotland Simon Stanley will be at ECOC 2023 on the Tuesday and Wednesday. ECOC is the largest conference and exhibition on … read more

Optical Networking Digital Symposium Day 2 Session 2: Expanding the Metro, Regional, and Long-Haul, Capacity and Reach – September 14, 2023

September 14, 2023 12:45 pm ETSponsors: Nokia, Fujitsu

As 800G upgrades are rolling out across the globe we will explore the opportunities and challenges presented by these … read more

Optical Networking Digital Symposium Day 1 Session 1: Coherent Pluggables – The Next Chapter

September 12, 2023 11:00 am ETSponsors: Lumentum

In this session, we will explore the challenges and the latest developments for both direct optical connections and coherent … read more

Webinar Signup

TDM Network Transformation to the Telco Cloud

Thursday, July 27, 2023, 11:00 a.m. New York / 4:00 p.m. LondonSponsors: Ribbon Register to listen

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