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Showing: Home / Webinars / Archived Webinars / Electronic and photonic building blocks for high-speed wireline transceivers

Electronic and photonic building blocks for high-speed wireline transceivers

Thursday, March 31, 2022, 11:00 a.m. New York / 4:00 p.m. London Sponsors: IMEC

Especially inside the large data centers that underpin today’s cloud and internet infrastructure, traffic keeps growing exponentially. As a result, the industry is now looking at 800G- and even 1.6T-capable optical (pluggable) transceivers, and co-packaged optics with even higher capacities. Maintaining transceiver footprints requires significant advances in terms of energy efficiency, integration density and bandwidth of both the electronic and photonic components of next-gen wireline transceivers.

Topics that will be addressed during this webinar include:

  • The use of SiGe BiCMOS to achieve beyond 100Gbaud operation as a more accessible alternative to compound semiconductors in analog electronic integrated circuits such as drivers and receivers.
  • The move towards 5- and even 3nm CMOS for next-generation ADCs and DACs.
  • Novel approaches for dense integration of electronic and photonic components with unprecedented integration density and manufacturing scalability.
  • Moving functionality from the electronic to the optical domain using new schemes such as optical domain equalizers.

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Simon Stanley

Simon is the Founder and Principal Consultant at Earlswood Marketing and has over 25 years experience, holding marketing and technical positions at various companies including National Semiconductor and Fujitsu covering Europe, North America and Japan. Simon has wide experience of networking technologies and semiconductor solutions including 100G/ 400G, NFV/SDN, LTE, ATCA, G.Fast/DSL, multicore processors, FPGAs and switch fabrics for both consumer and business applications.

Total Access – Components Reports

Access all Heavy Reading Components Reports providing in-depth research and competitive analyses for critical components and subsystems markets, including 100/400G optical, LTE, SDN, switch products, multicore processors, and white box/COTS components.

Events

Cloud Infrastructure and Operations for Open RAN

THURSDAY, OCTOBER 20, 2022 12:45 PM EDTSponsors: Wind River, Red Hat Intel

Open RAN introduces new opportunities to deploy RAN on cloud infrastructure. This session discusses how open RAN technology enables cloud … read more

Delivering Coherent Pluggable Optics from Edge to Metro and Beyond

Tuesday, September 13, 2022 11:00 AM EDTSponsors: Infinera, Juniper, Effect Photonics

What started out as an initiative to develop a standardized, compact and efficient coherent pluggable module for data center interconnects … read more

Webinar Signup

Service Provider AI Survey 2022: Charting the Way Forward for Accelerating AI Deployment in Data Centers

Tuesday, August 23, 2022, 12:00 p.m New York / 5:00 p.m LondonSponsors: CoreSite, Ericsson Register to listen

Taking your subscribers to gigabit and beyond

Wednesday, August 31, 2022, 2:00 p.m. New York / 7:00 p.m. LondonSponsors: Zyxel Communications Register to listen

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